An experiment on integrated circuits was reported by Phadke et al.
(1983). The width of lines made by a photoresist-nanoline tool were
measured in five different locations on silicon wafers, measurements being
taken before and after an etching process being treated separately.
Here, the pre-etching data are analyzed. The eight experimental factors
(A-H) were arranged in an L18 orthogonal array and produced 33
measurements at each of five locations, giving a total of 165 observations.
There were no whole-plot (i.e. between-wafer) factors.
Usage
data("circuit")
Format
A data frame with 165 observations on the following 13 variables.
Width
width of lines made by a photoresist-nanoline tool
A
a factor A with levels 1, 2 and 3
B
a factor B with levels 1, 2 and 3
C
a factor C with levels 1, 2 and 3
D
a factor D with levels 1, 2 and 3
E
a factor E with levels 1, 2 and 3
F
a factor F with levels 1, 2 and 3
G
a factor G with levels 1, 2 and 3
H
a factor H with levels 1, 2 and 3
I
a factor I with levels 1, 2 and 3
Wafer
wafers indenfifier
waf
replication number for two replicates
exp
experiment number for differenct array
References
Phadke, M.S., Kacka, R.N., Speeney, D.V. and Grieco, M.J. (1983).
Off-line quality control for integrated circuit fabrication using experimental
design. Bell System Technical Journal, 62, 1273–1309.